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3D IC Stacking Technology, by Banqiu Wu, Ajay Kumar, Sesh Ramaswami
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The latest advances in three-dimensional integrated circuit stacking technology
With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.
3D IC Stacking Technology covers:
- High density through silicon stacking (TSS) technology
- Practical design ecosystem for heterogeneous 3D IC products
- Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
- Process integration for TSV manufacturing
- High-aspect-ratio silicon etch for TSV
- Dielectric deposition for TSV
- Barrier and seed deposition
- Copper electrodeposition for TSV
- Chemical mechanical polishing for TSV applications
- Temporary and permanent bonding
- Assembly and test aspects of TSV technology
- Sales Rank: #1944301 in Books
- Published on: 2011-07-28
- Original language: English
- Number of items: 1
- Dimensions: 9.30" h x .91" w x 6.30" l, 1.70 pounds
- Binding: Hardcover
- 544 pages
About the Author
Banqiu Wu is Chief Technology Officer, TSV and Mask Products Business Group, Applied Materials, Inc. Dr. Wu has published over 50 technological papers in 10 peer-reviewed journals and conference proceedings, and authored/co-authored several books, including Photomask Fabrication Technology and Extreme Ultraviolet Lithography. He holds multiple patents and awards.
Dr. Ajay Kumar is Vice President and General Manager of TSV and Mask Products Business Group, Applied Materials, Inc. He has more than 75 publications to his credit in various journals including several review articles. Dr. Kumar co-authored the book Extreme Ultraviolet Lithography. He holds more than 100 US patents and has won many awards for innovation and commercialization.
Sesh Ramaswami is a senior director of TSV strategy and marketing at Applied Materials, Inc. His responsibilities include TSV and associated wafer level processing for packaging. Ramaswami holds 35 US patents and has 40+ conference publications and presentations in conferences such as MRS, ECS, VMIC, AVS, SPIE and IRPS.
Most helpful customer reviews
3 of 3 people found the following review helpful.
3D IC Stacking Technology - Book Review
By Zvi Or-Bach
3D IC Stacking Technology - Book Review
We really enjoyed reading the 3D-IC book. Below is feedback from our review:
* Excellent book, gives great understanding of process parameters of 3D-TSV technology. Easily the best book we have seen on the subject.
* The book provides the foundation technology for 3D IC Stacking using TSV
A few comments:
* A chapter on fine-pitch TSV technology (similar to what we wrote in our recent blog post:[...]) would be an important addition in future editions
* A book on 3D should have at least one chapter on monolithic 3D. Monolithic 3D NAND flash is turning out to be a major area, with Toshiba, Samsung, etc talking about production in 2013-2014.
* An in-depth analysis of the cost aspect and the technologies which present an opportunity to reduce the 3D IC cost (and allow wide spread adoption) would help.
We strongly recommend this book to technologists who like to get basic understanding on this emerging field, and to those that are already working in this exciting new field.
Zvi Or-Bach and Deepak Sekar
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